SC1174 Silicon Nitride Bonded Silicon Carbide (NBSC)

Silicon Nitride Bonded Silicon Carbide Properties

Silicon Nitride Bonded Silicon Carbide

Compound Formula	SiC
Molecular Weight	40.1
Appearance	Black
Melting Point	2,730° C (4,946° F) (decomposes)
Density	3.0 to 3.2 g/cm3
Electrical Resistivity	1 to 4 10x Ω-m
Poisson’s Ratio	0.15 to 0.21
Specific Heat	670 to 1180 J/kg-K

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Silicon Nitride Bonded Silicon Carbide Description

Silicon nitride bonded silicon carbide (NBSC) is well-known for its excellent wear resistance and oxidation resistance, high thermal conductivity and thermal shock resistance, even at high temperatures. Nitride bonded silicon carbide materials also possesses ideal refractory and chemical properties. NBSC resists wetting by non-ferrous metals. It is a semiconductor at high temperatures.

Silicon Nitride Bonded Silicon Carbide Specifications

>Chemical Composition	Sic	75%
	Si₃N₄	≥23%
	Free Si	0%
Bulk density (g/cm³)		2.70～2.80
Apparent porosity (%)		12～15
Bend strength at 20 ^oC (MP_a)		180～190
Bend strength at 1200 ^oC (MP_a)		207
Bend strength at 1350 ^oC (MP_a)		210
Compressive strength at 20 ^oC (MP_a)		580
Thermal conductivity at 1200 ^oC (w/m.k)		19.6
Thermal expansion coefficient at1200 ^oC (x 10-6/^oC)		4.70
Thermal shock resistance		Excellent
Max. temperature (^oC)		1600

Silicon Nitride Bonded Silicon Carbide Applications

-NBSC is widely used in mining, petrochemical, red metal, monolithic cyclone liners, etc.
-NBSCbricks are applied in a range of process furnaces and kiln furnitures.

Packing Service

ACM’s silicon nitride bonded silicon carbide refractory materials are carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.